LGA 3647
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| Type | LGA |
|---|---|
| Chip form factors | Flip-chip land grid array (FCLGA) |
| Contacts | 3647 |
| FSB protocol | |
| Processor dimensions | 76.0 mm × 56.5 mm |
| Processors | |
| Predecessor | |
| Memory support | DDR4 |
|
This article is part of the CPU socket series |
|
LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 (“Knights Landing”)[2], Xeon Phi 72×5 (“Knights Mill”), Skylake-SP, Cascade Lake-SP/AP, Skylake-SP and Cascade Lake-W microprocessors.[3]
The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect.
Variants[edit]
There are two sub-versions of this socket with differences in the ILM (Independent Loading Mechanism), and the processor package carrier frame (square, and narrow) preventing mounting the other version’s heatsink. company heatsincs designed for this socket, come with both the square, and narrow carrier frames.
- LGA3647-0 (socket P0) used for Skylake-SP and Cascade Lake-SP/AP processors[4]
- LGA3647-1 (socket P1) used for Xeon Phi x200 processors[5]