LGA 3647

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LGA 3647

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LGA 3647
Type LGA
Chip form factors Flip-chip land grid array (FCLGA)
Contacts 3647
FSB protocol
Processor dimensions 76.0 mm × 56.5 mm
Processors
Predecessor
Memory support DDR4

This article is part of the CPU socket series

LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 (“Knights Landing”)[2]Xeon Phi 72×5 (“Knights Mill”), Skylake-SPCascade Lake-SP/APSkylake-SP and Cascade Lake-W microprocessors.[3]

The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect.

Variants[edit]

There are two sub-versions of this socket with differences in the ILM (Independent Loading Mechanism), and the processor package carrier frame (square, and narrow) preventing mounting the other version’s heatsink. company heatsincs designed for this socket, come with both the square, and narrow carrier frames.

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